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• [Buy 3 Take 3] Circuit Board Adhesive 5G Thermal Conductive Heatsink Viscous Adhesive Glue Compound Glue CPU Heat Sink Sealant Description: 1.It has excessive energy and fast bonding effect, and is acceptable for instantly attaching varied components, LEDs and warmth sinks. 2.Good thermal conductivity, strong adhesion, vacuum packaging isn't smooth to oxidize and , good viscosity, brief drying time. 3.It has good conductivity, wide operating temperature differ (-60~200°C), and temporary resistance to 300°C. 4.It has brief floor curing time, long garage period, non-toxic, solvent-free, and may be safely utilized to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, warmth sinks, etc. 5.Instructions: 1) Extrusion of the product straight during use, rubbing the surface of the adherend, and straight protecting it after use, in case of trial back 2) The floor fixed velocity is expounded to the relative humidity and temperature in the air; the higher the temperature, the speedier the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to wash the skin of the bonded object before use (such as alcohol), keep away from cleaning with detergent, and observe it after the skin is clean. 6.The kit is sealing and the product is roofed with a vacuum bag to insulate the air and develop the garage time. Specifications: Thermal properties, strong glue adhesion. Specifications: 5g (single) Melting amount: zero (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: <0.06 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: <0.005  

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