विवरण

• ZEXEF 1-5Pcs Thermal Paste Conductive Heatsink Plaster Viscous Adhesive For Chip VGA RAM LED IC Cooler Radiator Cooling Sealer Description: 1 has excessive strength and rapid bonding effect, and is appropriate for instantly attaching diverse components, LEDs and warmth sinks 2 thermal conductivity, strong adhesion, vacuum packaging isn't always clean to oxidize and , nice viscosity, short drying time 3 has good conductivity, huge operating temperature vary (-60~200°C), and short-term resistance to 300°C 4 has short surface curing time, lengthy storage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, warmth sinks, and so on 5: 1) Extrusion of the product directly during use, rubbing the outside of the adherend, and straight covering it after use, in case of trial again 2) The floor constant speed is said to the relative humidity and temperature in the air; the higher the temperature, the quicker the curing speed, and vice versa 3) Recommended thickness: 0, the thinner the higher 4) Please use solvent to clean the skin of the bonded object before use (such as alcohol), keep away from cleaning with detergent, and apply it after the outside is clear 6 package is sealing and the product is covered with a vacuum bag to insulate the air and develop the storage time Specifications: Thermal properties, stable glue adhesion Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0% (200°C/24 Hours) Thermal Conductivity: >0/m-K Impedance: <0 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1 Margin Coefficient: >5 Scatter Coefficient: <0 Package Included: 1 x Heatsink Plaster

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