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• Thermal Paste Glue Conductive Paste Viscous Adhesive Conductive Heatsink Plaster Glue For Chip VGA RAM LED IC Cooling Radiator Description: 1.It has excessive energy and fast bonding effect, and is acceptable for straight attaching different components, LEDs and warmth sinks. 2.Good thermal conductivity, strong adhesion, vacuum packaging is not easy to oxidize and , nice viscosity, brief drying time. 3.It has nice conductivity, vast working temperature differ (-60~200°C), and short-term resistance to 300°C. 4.It has quick floor curing time, lengthy storage period, non-toxic, solvent-free, and might be safely utilized to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc. 5.Instructions: 1) Extrusion of the product immediately throughout use, rubbing the outside of the adherend, and straight masking it after use, in case of trial again 2) The surface constant velocity is related to the relative humidity and temperature in the air; the better the temperature, the speedier the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to scrub the surface of the bonded object earlier than use (such as alcohol), avoid cleansing with detergent, and follow it after the outside is clean. 6.The package is sealing and the product is covered with a vacuum bag to insulate the air and increase the garage time. Specifications: Thermal properties, strong glue adhesion. Specifications: 5g (single) Melting amount: zero (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: <0.06 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: <0.005 Package Included: 1 x Heatsink Plaster  

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