Description

• 1.It has high strength and fast bonding effect, and is acceptable for directly attaching various components, LEDs and warmth sinks.2.Good thermal conductivity, stable adhesion, vacuum packaging isn't easy to oxidize and dry, nice viscosity, quick drying time.3.It has good conductivity, large operating temperature fluctuate (-60~200°C), and non permanent resistance to 300°C.4.It has short floor curing time, lengthy garage period, non-toxic, solvent-free, and may be safely utilized to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, warmth sinks, etc.5.Instructions:1) Extrusion of the product immediately throughout use, rubbing the outside of the adherend, and immediately masking it after use, in case of trial again2) The floor constant speed is expounded to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa.3) Recommended thickness: 0.1-0.5mm, the thinner the better.4) Please use solvent to wash the skin of the bonded object earlier than use (such as alcohol), avoid cleansing with detergent, and follow it after the surface is clean.6.The package is sealing and the product is roofed with a vacuum bag to insulate the air and increase the storage time._________Thermal properties, strong glue adhesion. Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: <0.06 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: <0.005

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