Description

• [Buy three Take 3] Circuit Board Adhesive 5G Thermal Conductive Heatsink Viscous Adhesive Glue Compound Glue CPU Heat Sink Sealant Description: 1.It has high energy and rapid bonding effect, and is acceptable for immediately attaching diverse components, LEDs and heat sinks. 2.Good thermal conductivity, solid adhesion, vacuum packaging is not clean to oxidize and , nice viscosity, short drying time. 3.It has nice conductivity, extensive operating temperature range (-60~200°C), and temporary resistance to 300°C. 4.It has quick floor curing time, long storage period, non-toxic, solvent-free, and may be safely utilized to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, warmth sinks, etc. 5.Instructions: 1) Extrusion of the product straight during use, rubbing the surface of the adherend, and instantly overlaying it after use, in case of trial back 2) The floor constant pace is expounded to the relative humidity and temperature within the air; the higher the temperature, the faster the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to scrub the skin of the bonded object before use (such as alcohol), avoid cleansing with detergent, and follow it after the skin is clean. 6.The kit is sealing and the product is covered with a vacuum bag to insulate the air and increase the garage time. Specifications: Thermal properties, strong glue adhesion. Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: <0.06 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: <0.005    

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