Description

• High Hard Epoxy Resin Potting Adhesive Soft Silicone Electronic Potting Glue Insulated Waterproof Circuit Board Pouring SealantDescriptionReport ItemSilicone electronic potting glue sealing insulation thermal conduction power battery pack circuit board water resistant AB mushy glueThis glue is a two-component silicone digital potting glue, with sealing, insulation, thermal conductivity, excessive and occasional temperature resistance, coloration is split into black, gray, transparent, and white, hardness is split into demanding glue and tender glue, the mixing ratio is also different , and extra products with weight specs could be customized, please consult us for detailsPackaging upgrade, label genre is different, please don't order once you mindparameterName: Silicone electronic potting AB glueSpecifications: 200gColor: black, white, clear, grayMixing ratio: 1:1Operation time: about 30 minutesCuring time: 1-10 hours for initial curing, 24 hours for full curingFeatures: insulation, waterproof, thermal conductivity, confidentiality, anti-corrosion, anti-vibration, flame retardantApplication areas: varied sensor potting, precision electronic module potting, lights fixture potting, strength module potting protection, etc.H598 is a gray, low viscosity two aspect addition molding silicone sealant that may be cured at room temperature or heated after being jumbled together a weight ratio of 1:1. It has the attribute of quicker curing at greater temperatures. This product does not produce any by-products or strain throughout the curing process, and will not cause pressure strain on electronic devices; Applied to numerous electronic products for sealing and protection, it has applications similar to sealing, waterproofing, insulation, thermal conductivity, flame retardancy, etc. After curing, it can be used in environments starting from -50 ℃ to 200 ℃.Product Features1. Sealing, insulation, water resistant and moisture-proof, dustproof and anti-corrosion.2. Glue has good flowability, self leveling, and good permeability.3. Flame retardant grade UL94-V-0, with nice flame retardant effect.4. High temperature resistance of 2 hundred ℃, low temperature of -50 ℃, and good growing older resistance.5. Soft gel after curing, non damaging digital components, detachable, and repairable.6. Mix and solidify in line with a weight ratio of 1:1, with clear-cut operation and might be manually poured or automatically poured via machine.7. After mixing, it may be naturally cured or quickly cured by way of heating (the higher the temperature, the faster the curing speed).Typical Applications◆ Automotive electronics and modules ◆ LED power drive module ◆ Solar module junction field ◆ Electric car charging column module ◆ Lithium battery pack, capacitor bank ◆ Magnetic induction coil ◆ Inverter strength supplytechnical parameterBefore curingAppearance and morphologyComponent A: Grey liquidComponent B: White liquidViscosity (cps. 25 ℃): Component A: 3500-4500Component B: 3500-4500Mixing ratio A component: B component=100:100 (weight ratio)Room temperature usage time (25 ℃): 30-50minForming time (h)30 ℃ Forming time: 1-3h25 ℃ Forming time: 3-5 hoursForming time at 20 ℃: 5-10 hoursCuring time (25 ℃): 24 hours (25 ℃ -30 minutes)After curingAppearance: Gray elastomerHardness (Shore A): 55-65Thermal conductivity coefficient (W/m.K): 1.0Elongation at destroy (%): 200-350Volume resistivity (Ω · cm): ≥ 1.0 × 10[14]Breakdown voltage (kV/mm): 18-25Dielectric loss attitude tangent (1MHz): ≤ 4 × 10[-3]Dielectric fixed (1.0MHz): 2.6-3.1Operating temperature fluctuate (℃): -50~200*The above data information is for reference only, and the specific size by the person shall prevail! Not used as a foundation and traditional for acceptance!Usage Guidelines1. Before mixing: First, place aspect A and factor B of their respective bins and stir thoroughly.2. When mixing: The weight ratio of A ingredient to B factor should be followed at 1:1, and the mixture should be stirred evenly.3. Bubble removal: After blending the rubber material, it can be vacuumed for 1-3 minutes.4. Sealing: The mixed adhesive should be poured into the poured product as soon as probable to circumvent thickening and poor fluidity of the adhesive in the later stage.5. Curing: Cure at room temperature for twenty-four hours, or at elevated temperature. The higher the temperature, the faster the curing speed.matters desiring attention1. The adhesive must be stored in a sealed and dry room temperature environment, and the combined adhesive needs to be used up as quickly as probable to circumvent waste.2. This product isn't always a hazardous material, but do not input or eye contact.3. This product is non-toxic, has good physiological inertness, and has no irritation or harm to the skin.4. The product doesn't contain flammable and explosive components, and will not cause fire or explosion accidents. There are no special requirements for transportation.

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