Description

• Thermal Paste Glue Conductive Paste Viscous Adhesive Conductive Heatsink Plaster Glue For Chip VGA RAM LED IC Cooling RadiatorDescription:1.It has excessive energy and speedy bonding effect, and is appropriate for immediately attaching different components, LEDs and warmth sinks. 2.Good thermal conductivity, strong adhesion, vacuum packaging isn't always easy to oxidize and , nice viscosity, brief drying time. 3.It has good conductivity, large working temperature range (-60~200°C), and temporary resistance to 300°C. 4.It has quick surface curing time, long storage period, non-toxic, solvent-free, and may be safely utilized to elastic bonding, heat dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc. 5.Instructions: 1) Extrusion of the product immediately during use, rubbing the outside of the adherend, and instantly protecting it after use, in case of trial back 2) The surface constant velocity is expounded to the relative humidity and temperature in the air; the better the temperature, the quicker the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to wash the skin of the bonded object before use (such as alcohol), avoid cleansing with detergent, and practice it after the surface is clean. 6.The kit is sealing and the product is covered with a vacuum bag to insulate the air and broaden the storage time.Specifications:Thermal properties, stable glue adhesion. Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: Package Included:1 x Heatsink Plaster

• 
• 
• 
• 
• 

Review