Description

• ZEXEF 1-10PCS Thermal Paste Conductive Heatsink Plaster Viscous Adhesive for Chip VGA RAM LED IC Cooler Radiator Cooling Sealers Description: 1 has high energy and rapid bonding effect, and is appropriate for directly attaching various components, LEDs and heat sinks 2 thermal conductivity, solid adhesion, vacuum packaging isn't always easy to oxidize and , nice viscosity, quick drying time 3 has nice conductivity, huge operating temperature range (-60~200°C), and non permanent resistance to 300°C four has brief floor curing time, long storage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, and so forth 5: 1) Extrusion of the product directly throughout use, rubbing the outside of the adherend, and straight overlaying it after use, in case of trial again 2) The floor constant speed is related to the relative humidity and temperature in the air; the higher the temperature, the quicker the curing speed, and vice versa 3) Recommended thickness: 0, the thinner the better 4) Please use solvent to scrub the surface of the bonded object before use (such as alcohol), keep away from cleansing with detergent, and follow it after the surface is clear 6 kit is sealing and the product is covered with a vacuum bag to insulate the air and broaden the garage time Specifications: Thermal properties, strong glue adhesion Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0% (200°C/24 Hours) Thermal Conductivity: >0/m-K Impedance: <0 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1 Margin Coefficient: >5 Scatter Coefficient: <0 Package Included: 1 x Heatsink Plaster

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