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• Conductive Heatsink Efficient Advanced Enhanced Thermal Conductivity State-of-the-art Next-generation Led Ic Reliable InnovativeDescription:1.It has high power and instant bonding effect, and is suitable for immediately attaching different components, LEDs and heat sinks. 2.Good thermal conductivity, solid adhesion, vacuum packaging is not smooth to oxidize and , nice viscosity, quick drying time. 3.It has good conductivity, broad working temperature differ (-60~200°C), and momentary resistance to 300°C. 4.It has brief floor curing time, lengthy garage period, non-toxic, solvent-free, and may be safely utilized to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc. 5.Instructions: 1) Extrusion of the product immediately during use, rubbing the outside of the adherend, and straight protecting it after use, in case of trial again 2) The surface constant velocity is related to the relative humidity and temperature within the air; the better the temperature, the quicker the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to clean the surface of the bonded object before use (such as alcohol), avoid cleansing with detergent, and observe it after the surface is clean. 6.The package is sealing and the product is covered with a vacuum bag to insulate the air and expand the storage time.Specifications:Thermal properties, solid glue adhesion. Specifications: 5g (single) Melting amount: zero (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: Package Included:1 x Heatsink Plaster

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