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• ZEXEF 1-5Pcs Thermal Paste Conductive Heatsink Plaster Viscous Adhesive For Chip VGA RAM LED IC Cooler Radiator Cooling Sealer Description: 1 has high energy and quick bonding effect, and is appropriate for instantly attaching assorted components, LEDs and heat sinks 2 thermal conductivity, strong adhesion, vacuum packaging isn't always easy to oxidize and , good viscosity, brief drying time three has good conductivity, huge working temperature fluctuate (-60~200°C), and non permanent resistance to 300°C four has short surface curing time, long garage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc 5: 1) Extrusion of the product immediately throughout use, rubbing the surface of the adherend, and immediately overlaying it after use, in case of trial again 2) The floor fixed velocity is expounded to the relative humidity and temperature within the air; the better the temperature, the speedier the curing speed, and vice versa 3) Recommended thickness: 0, the thinner the better 4) Please use solvent to clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and practice it after the surface is clean 6 kit is sealing and the product is covered with a vacuum bag to insulate the air and develop the garage time Specifications: Thermal properties, solid glue adhesion Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0% (200°C/24 Hours) Thermal Conductivity: >0/m-K Impedance: <0 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1 Margin Coefficient: >5 Scatter Coefficient: <0 Package Included: 1 x Heatsink Plaster

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