说明

• Description: 1 has high power and speedy bonding effect, and is suitable for straight attaching varied components, LEDs and heat sinks 2 thermal conductivity, strong adhesion, vacuum packaging isn't clean to oxidize and dry, good viscosity, quick drying time 3 has good conductivity, huge working temperature fluctuate (-60~200°C), and momentary resistance to 300°C 4 has short floor curing time, long storage period, non-toxic, solvent-free, and may be safely applied to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, warmth sinks, and so on 5: 1) Extrusion of the product instantly during use, rubbing the outside of the adherend, and straight covering it after use, in case of trial again 2) The floor constant speed is said to the relative humidity and temperature within the air; the higher the temperature, the faster the curing speed, and vice versa 3) Recommended thickness: 0, the thinner the better 4) Please use solvent to scrub the outside of the bonded object earlier than use (such as alcohol), avoid cleansing with detergent, and follow it after the skin is clear 6 kit is sealing and the product is roofed with a vacuum bag to insulate the air and broaden the garage time Specifications: Thermal properties, solid glue adhesion Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0% (200°C/24 Hours) Thermal Conductivity: >0/m-K Impedance: <0 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1 Margin Coefficient: >5 Scatter Coefficient: <0 Package Included: 1 x Heatsink Plaster

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审核