说明

• ZEXEF Thermal Paste Heat Conductive Glue Heatsink Plaster Viscous Chip VGA RAM LED Cooler Radiator Cooling Extra Strong Glue Description: 1 has excessive strength and fast bonding effect, and is acceptable for immediately attaching different components, LEDs and warmth sinks 2 thermal conductivity, stable adhesion, vacuum packaging isn't clean to oxidize and , good viscosity, brief drying time three has nice conductivity, broad operating temperature range (-60~200°C), and temporary resistance to 300°C four has brief floor curing time, long storage period, non-toxic, solvent-free, and might be safely utilized to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, warmth sinks, and many others 5: 1) Extrusion of the product directly during use, rubbing the skin of the adherend, and straight covering it after use, in case of trial again 2) The floor fixed speed is said to the relative humidity and temperature within the air; the better the temperature, the speedier the curing speed, and vice versa 3) Recommended thickness: 0, the thinner the higher 4) Please use solvent to clean the surface of the bonded object earlier than use (such as alcohol), keep away from cleaning with detergent, and follow it after the skin is clear 6 package is sealing and the product is covered with a vacuum bag to insulate the air and increase the storage time Specifications: Thermal properties, strong glue adhesion Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0% (200°C/24 Hours) Thermal Conductivity: >0/m-K Impedance: <0 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1 Margin Coefficient: >5 Scatter Coefficient: <0 Package Included: 1 x Heatsink Plaster

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