说明

• 1~10PCS 5/10/15g Thermal Paster Conductive Heatsink Plaster Viscous Adhesive Glue For Chip VGA RAM LED IC 8CKC Cooler Radiator Description: 1.It has excessive power and speedy bonding effect, and is acceptable for straight attaching assorted components, LEDs and heat sinks. 2.Good thermal conductivity, stable adhesion, vacuum packaging isn't smooth to oxidize and , good viscosity, short drying time. 3.It has good conductivity, wide operating temperature range (-60~200°C), and short-term resistance to 300°C. 4.It has quick surface curing time, long storage period, non-toxic, solvent-free, and may be safely utilized to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc. 5.Instructions: 1) Extrusion of the product immediately throughout use, rubbing the outside of the adherend, and straight protecting it after use, in case of trial again 2) The floor constant velocity is related to the relative humidity and temperature within the air; the better the temperature, the speedier the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to scrub the surface of the bonded object earlier than use (such as alcohol), keep away from cleansing with detergent, and observe it after the surface is clean. 6.The package is sealing and the product is covered with a vacuum bag to insulate the air and expand the storage time. Specifications: Thermal properties, strong glue adhesion. Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: <0.06 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: <0.005 Package Included: 1 x Heatsink Plaster  

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