Beschreibung

• Description: 1.It has excessive power and immediate bonding effect, and is acceptable for directly attaching different components, LEDs and heat sinks. 2.Good thermal conductivity, strong adhesion, vacuum packaging isn't always clean to oxidize and dry, nice viscosity, quick drying time. 3.It has nice conductivity, vast working temperature range (-60~200°C), and non permanent resistance to 300°C. 4.It has short floor curing time, long storage period, non-toxic, solvent-free, and can be safely applied to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, warmth sinks, etc. 5.Instructions: 1) Extrusion of the product straight throughout use, rubbing the outside of the adherend, and immediately covering it after use, in case of trial back 2) The floor constant velocity is expounded to the relative humidity and temperature within the air; the higher the temperature, the faster the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to scrub the outside of the bonded object earlier than use (such as alcohol), avoid cleansing with detergent, and practice it after the skin is clean. 6.The equipment is sealing and the product is covered with a vacuum bag to insulate the air and broaden the garage time. Specifications: Thermal properties, solid glue adhesion. Specifications: 5g (single) Melting amount: zero (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: <0.06 Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: <0.005 Package Included: 1 x Heatsink Plaster    

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