Descriptions

• 1pcs 5g Thermal Paste Conductive Heatsink Plaster Viscous Adhesive Glue High-Performance CPU LED IC Conductive Heatsink Glue Description: 1.It has high energy and fast bonding effect, and is appropriate for instantly attaching different components, LEDs and heat sinks. 2.Good thermal conductivity, solid adhesion, vacuum packaging is not easy to oxidize and dry, nice viscosity, short drying time. 3.It has nice conductivity, huge operating temperature range (-60~200°C), and short-term resistance to 300°C. 4.It has short surface curing time, lengthy garage period, non-toxic, solvent-free, and might be safely applied to elastic bonding, warmth dissipation, insulation and packaging of electronics, instruments, LEDs, heat sinks, etc. 5.Instructions: 1) Extrusion of the product instantly during use, rubbing the surface of the adherend, and instantly overlaying it after use, in case of trial back 2) The surface fixed speed is expounded to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa. 3) Recommended thickness: 0.1-0.5mm, the thinner the better. 4) Please use solvent to scrub the outside of the bonded object earlier than use (such as alcohol), avoid cleansing with detergent, and observe it after the skin is clean. 6.The equipment is sealing and the product is covered with a vacuum bag to insulate the air and develop the storage time. Specifications: Thermal properties, solid glue adhesion. Specifications: 5g (single) Melting amount: 0 (200°C/24 Hours) Evaporation: 0.001% (200°C/24 Hours) Thermal Conductivity: >0.671W/m-K Impedance: Ging Time: 3min (25°C) Track Strength: 25Kg Strength of Connected Buildings: 1.5map Margin Coefficient: >5.1 Scatter Coefficient: Package Included: 1 x Heatsink Plaster

• 

Révision