Opisy

• Feature: 20ml BGA IC glue epoxy remover Can show you how to soften & eradicate resinating / sealing glue of chip BGA IC of cell phones smoothly Can soon melt and loosen solidified resin adhesive equivalent to epoxy, phenolics, acrylate, polyurethane, organosilicon and so on It won&;t do harm on your circuit board and components Environment friendly and safe Doesn&;t contain any Benzene Coderivative elements with cause leukaemia Convenient to apply How to Use: 1 Pick an larger size absorbent cotton than BGA IC with a tweezers and dip into the cutting off liquid Then conceal it frivolously on BGA IC chip which in need of glue cutting off 2 Place a plastic bag or film on the peak and cover the PCB board three Wait for about 20 minutes 4 Redo step 1 to step 3 five To eradicate the softened sealing glue in the outside of BGA IC chip with a tweezers Please pay attention to avoid unfavorable routes surrounding BGA and copper foil circuit round main board when removing the glue 6 Heat up the chip with a air software (300 deg) The glue in the backside will get soften and melt via warmth 7 To eliminate the chip with a tweezers or cutter Package: 1 x MECHANIC BGA IC glue epoxy remover

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