Opisy

• Name: Thermal conductive siliconThermal conductivity: GD32 thermal conductivity 1.0/GD66 thermal conductivity 1.05/GD100 thermal conductivity 1.094/GD220 thermal conductivity 1.114/GD450 thermal conductivity 2.0/GD460 thermal conductivity 2.0/GD900 thermal conductivity 4.8/GD007 thermal conductivity 6.8Specifications: 0.5G in a single small bag, 50 luggage in one packageUsage: Can be used for heat conduction and warmth dissipation of electronic components, CPU, GPU, MOS tubes, LEDs, etc., thermostats, etc.Packing list1

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